3M News Center
Press Releases
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Jun 25, 2009
3M Electronic Solutions Division now offers new cabling solutions for users of high-performance digital camera applications. The High Speed 0.8 mm Cable Assemblies for Power over Camera Link...
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Jun 24, 2009
The new 19-micron 3M Embedded Capacitance Material (ECM), introduced by 3M Electronic Solutions Division, offers printed circuit board manufacturers a high-performing choice for cost-sensitive...
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Jun 24, 2009
- Ruling Confirms 3M’s Right to Sell Scotch-Brite™ Floor Pads - The Opposition Division of the European Patent Office (EPO) recently revoked, in its entirety, HTC’s European patent directed...
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Jun 24, 2009
3M, a leading supplier of advanced materials to the semiconductor industry, and SUSS MicroTec, a leading supplier of semiconductor processing equipment, today announced an agreement to expand...
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Jun 23, 2009
3M and 3M Innovative Properties Co. filed a patent infringement lawsuit in federal district court for the District of Minnesota today against EnvisionWare Inc. seeking injunctive relief and...
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