3M will present two papers on its embedded capacitor materials at IMAPS 2005, the 38th International Symposium on Microelectronics, held at the Pennsylvania Convention Center, Philadelphia, Penn., Sept. 25 to 29.

The first presentation, "Thin Substrate Flip Chip Assembly - Managing Substrate Warp Through Controlled Thermal Process," will take place Tuesday, Sept. 27, 3:15 p.m. to 4:55 p.m. Shichun Qu, product development specialist, 3M Electronics Markets Materials Division, will present information on 3M multilayer IC substrate technologies, substrate warping challenges and managing warp through control of the thermal process.

A second presentation, "Decoupling of High-Speed Digital Electronics with Embedded Capacitance," will take place Wednesday, Sept. 28, 9:45 a.m. to 11:25 a.m. Joel S. Peiffer, applications engineering specialist, 3M Electronic Solutions Division, will present information on a 3M laminate material that allows designers and manufacturers of high-speed, digital-printed circuit boards to achieve higher speeds while simplifying design trade-offs. When used as a power-ground core in a multilayer printed circuit board, 3M embedded capacitor material effectively becomes a decoupling capacitor inside the board. The material allows designers to eliminate large numbers of decoupling capacitors, increasing useable board area; enables faster signaling; lowers radiated emissions (EMI); and saves engineering time associated with power distribution design and board layout. Printed circuit board fabricators can use the material in military, automated test equipment, computer and telecommunications applications.

For more information about 3M brand embedded capacitor material, visit www.3M.com/imaps.

About 3M Electronics

3M Electronics, co-located in Austin, Texas, and St. Paul, Minn., has numerous technologies and provides a wide range of products for the electronics market. The business provides products and solutions to meet the electronic industry's challenges of protecting sensitive components and precisely delivering them to the assembly point, such as carrier and cover tapes and trays, as well as flexible and multilayer microinterconnect packaging solutions; embedded capacitor materials; copper and fiber interconnect systems; cables and cable assemblies; static control products, Textool brand test and burn-in sockets; tapes, abrasives, chemicals and materials, and ceramic textiles and composites.

About 3M - A Global, Diversified Technology Company

Every day, 3M people find new ways to make amazing things happen. Wherever they are, whatever they do, the company's customers know they can rely on 3M to help make their lives better. 3M's brands include Scotch, Post-it, Scotchgard, Thinsulate, Scotch-Brite, Filtrete, Command and Vikuiti. Serving customers in more than 200 countries around the world, the company's 67,000 people use their expertise, technologies and global strength to lead in major markets including consumer and office; display and graphics; electronics and telecommunications; safety, security and protection services; health care; industrial and transportation. For more information, including the latest product and technology news, visit www.3M.com.

3M, Textool, Scotch, Post-it, Scotchgard, Thinsulate, Scotch-Brite, Filtrete, Command and Vikuiti are trademarks of 3M.

3MMatt Fagan, 512-984-3277