SANTA CLARA, Calif.--(BUSINESS WIRE)--3M announced today at DesignCon 2013 the full launch of its Embedded
Capacitance Material (ECM) C2006. The ultra-thin laminate material
is now available for high-volume manufacturing. With a capacitance
density of approximately 20 nF per square inch, the material offers one
of the highest capacitance densities currently available on the market
in a halogen-free* product.
ECM C2006 boosts design engineers’ ability to improve power integrity
and reduce electromagnetic interference (EMI) in small devices – such as
microphones, sensors, IC packaging and interposers – where space
limitations require the highest capacitance density feasible to achieve
the desired performance. The material’s high capacitance density helps
designers achieve hi-fidelity signals, high signal-to-noise ratio in
radio frequencies and higher speed digital signals in a variety of
high-performance applications.
“The trend toward smaller devices with better performance shows no signs
of slowing,” said Abhay Joshi, global business development manager, 3M
Electronic Solutions Division, Interconnect Business. “Embedded
Capacitance Material C2006 from 3M offers one of the highest capacitance
densities available today. Now that we are ramped up to full production,
design engineers can take advantage of this tool to help them design
smaller, higher-performing products.”
3M’s line of ECM offerings can be embedded into printed circuit boards
(PCBs) and integrated circuit chip packages where the applications
include decoupling and low-pass filtering. With a high-capacitance
density offering, the functionality of the material can now be ideally
leveraged for microphone makers in the miniaturization of their products.
When used as a power-ground core in a multilayer PCB, ECM effectively
becomes a decoupling capacitor inside the board, which can allow
designers to eliminate large numbers of decoupling capacitors. The
material can increase useable board area, enable faster signaling, lower
radiated emissions and save engineering time associated with
power-distribution design and board layout.
Fabricators and OEMs worldwide can use ECM from 3M without purchasing a
license from 3M. The material is halogen-free* and RoHS compliant**.
Samples of ECM C2006 are available at the 3M booth (#414) at the
DesignCon 2013 Expo, which takes place Jan. 29-30 at the Santa Clara
Convention Center. To learn more about ECM solutions from 3M, visit www.3Mcapacitance.com.
About 3M Electronic Solution Division – Interconnect
3M
Electronic Solutions Division’s Interconnect business offers a variety
of innovative connectors, cables and cable assemblies, embedded
capacitance materials and Textool brand test and burn-in sockets for
component engineers and designers in the electronics industry. For more
information about 3M’s Interconnect solutions, visit: http://www.3Mconnectors.com.
Information about 3M Company is available online.
3M and Textool are trademarks of 3M Company.
All other trademarks
listed herein are owned by their respective companies.
*Halogen-free is defined as both (1) no halogen compounds are
intentionally added to the product or used in the manufacturing process
for the product, and (2) any impurities present are less than 900 ppm
bromine, less than 900 ppm chlorine, and/or less than 1500 ppm total
bromine and chlorine. The latter are the levels set forth in certain
industry standards for printed circuit boards, such as the International
Electrotechnical Commission (IEC) 61249-2-21standard.
**"RoHS 2011/65/EU" means that the product or part does not contain any
of the substances in excess of the maximum concentration values (“MCVs”)
in EU RoHS Directive 2011/65/EU. The MCVs are by weight in homogeneous
materials. This information represents 3M's knowledge and belief, which
may be based in whole or in part on information provided by third party
suppliers to 3M.
