"says Duane Preiss, marketing manager, Systems and Components Business, 3M Electronic Solutions Division."
AUSTIN, Texas--(BUSINESS WIRE)--A new cable-to-board interconnect solution from 3M can help designers of
high-performance electronic systems meet the ever-increasing demand for
high-density equipment.
The 3M Electronics Solutions Division has launched the 3M™ Ribbon Cable
Wiremount Socket Assembly, .050” x .050”, 451 Series and the 3M™
Shrouded Boardmount Header, .050” x .050”, 452 Series. The small, robust
socket and header mate together connecting .025” pitch ribbon cables to
printed circuit boards (PCBs). A variety of .025” pitch ribbon cables
are also available from 3M, forming a complete, end-to-end system of
header, socket and cable.
The compact header and socket help achieve high-performance electronic
equipment designs in a small form factor as required by today’s
communications, military/aerospace, industrial production, data center
and high-performance computing applications. The fine, .050” pitch saves
space on the PCB, allowing for high connection density.
“The demand for more processing power in smaller spaces continues to
drive the design of electronic hardware,” says Duane Preiss, marketing
manager, Systems and Components Business, 3M Electronic Solutions
Division. “This latest interconnect solution from 3M continues our
effort to help equipment manufacturers achieve higher-density designs to
meet the needs of their customers.”
The series 451 and 452 Series interconnect products from 3M also deliver
on performance, reliability and cost savings. The ribbon cable wiremount
socket assembly incorporates 3M insulation displacement contact (IDC)
technology in the connector, helping maintain secure connections and
high signal integrity. The IDC connector’s mass termination capability
allows the termination of 30 lines in a single cycle, reducing the need
for expensive automated termination equipment and allowing manual cable
assembly operations. Available friction-latch configurations and an
optional strain-relief accessory can further increase connection
reliability. An optional, unique header ejector latch mechanism provides
positive latch and ejection capability with minimal size addition.
The shrouded boardmount header is available in a variety of
configurations in order to maximize design flexibility while minimizing
PCB footprint. Tape-and-reel packaging for the SMT version of the header
is available for automated placement applications, and PCB standoffs
help enable pin-in-paste processing capability.
ESD is a leading provider of advanced electronic thin substrates and
sensors, components and comprehensive systems for enhancing and managing
electronic signal properties. The products help customers in consumer
electronics, touch panels, enterprise and networking, industrial and
factory automation, semiconductor and component markets worldwide.
For more information about 3M’s Interconnect Solutions, visit: http://www.3Mconnectors.com.
Information about 3M Company is available online.
3M is a trademark of 3M Company. All other trademarks listed herein
are owned by their respective companies.