"TF9: Thin and Very Thin Laminates for Power Distribution: What is New in 2004?"
AUSTIN, Texas--(BUSINESS WIRE)--The 3M Electronic Solutions Division will participate in presentations
on chip packaging and advanced materials at DesignCon 2004 in Santa
Clara, Calif. The electronics show and conference will take place Feb.
2-Feb. 5, at the Santa Clara Convention Center.
The TecForum "TF9: Thin and Very Thin Laminates for Power Distribution:
What is New in 2004?" will take place Feb. 2 from 1 p.m. to 4 p.m.
William M. Balliette, manager, new business development, 3M Electronic
Solutions, will present information on a new innovative 3M laminate
material that allows designers and manufacturers of high-speed digital
printed circuit boards to achieve higher speeds while simplifying design
tradeoffs. The 3M embedded capacitor material is used in a multilayer
PCB to connect other layers in a multilayer PCB, thus the 3M embedded
capacitor material effectively becomes a decoupling capacitor inside the
board. The material allows designers to eliminate large numbers of
decoupling capacitors, increases useable board area, enables faster
signaling, lowers radiated emissions (EMI), and saves engineering time
associated with power distribution design and board layout. Printed
circuit board fabricators can use the material in military, automated
test equipment, computer and telecommunications applications.
"Integrating 10G Serial onto a Large Digital CMOS ASSP: Taking 10G from
Lab to Production" is the title of a joint paper by Cortina Systems and
3M and will be presented Feb. 4 from 8:30 a.m. to 9:15 a.m. The paper
discusses the successful integration of 10G Serial I/O onto a large
integrated CMOS ASSP chip. 3M provides the multilayer IC
substrate/package. The 3M and Cortina Systems collaboration resulted in
a high-performance package and design guidelines that allows the package
to interface with a low-cost, standard FR-4 PCB and enables high speeds
at a lower cost. George Hare, 3M product development specialist dealing
with high-frequency/high-data-rate electrical modeling and simulation,
contributed to the paper.
About 3M Electronic Solutions Division
3M Electronic Solutions, part of 3M Company, has numerous technologies
and provides a wide range of products for the electronics market. It
provides flexible and multilayer microinterconnect packaging solutions;
copper and fiber connectors, cables, and assemblies; static control
products; tape and reel transport media for passive, semiconductor and
electro-mechanical components; and test and burn-in sockets. More
information on 3M Microinterconnect Products is available on the
Internet at http://www.3M.com/microinterconnect.
About 3M -- A Global, Diversified Technology Company
Every day, 3M people find new ways to make amazing things happen.
Wherever they are, whatever they do, the company's customers know they
can rely on 3M to help make their lives better. 3M's brands include
icons such as Scotch, Post-it, Scotchgard, Thinsulate, Scotch-Brite,
Filtrete, Command and Dyneon. Serving customers in more than 200
countries around the world, the company's 67,000 people use their
expertise, technologies and global strength to lead in major markets
including consumer and office; display and graphics; electronics and
telecommunications; safety, security and protection services; health
care; industrial and transportation. For more information, including the
latest product and technology news, visit www.3M.com.
3M, Scotch, Post-it, Scotchgard, Thinsulate, Scotch-Brite, Filtrete,
Command and Dyneon are trademarks of 3M.
Contact:
3M Electronic Solutions Division, Austin Matthew Fagan, 512-984-3277