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3M to Participate in DesignCon 2004 Technical Presentations on Chip Package Materials, Technologies

Monday, February 2, 2004 12:52 pm CST

Dateline:

AUSTIN, Texas
"TF9: Thin and Very Thin Laminates for Power Distribution: What is New in 2004?"

AUSTIN, Texas--(BUSINESS WIRE)--The 3M Electronic Solutions Division will participate in presentations on chip packaging and advanced materials at DesignCon 2004 in Santa Clara, Calif. The electronics show and conference will take place Feb. 2-Feb. 5, at the Santa Clara Convention Center.

The TecForum "TF9: Thin and Very Thin Laminates for Power Distribution: What is New in 2004?" will take place Feb. 2 from 1 p.m. to 4 p.m. William M. Balliette, manager, new business development, 3M Electronic Solutions, will present information on a new innovative 3M laminate material that allows designers and manufacturers of high-speed digital printed circuit boards to achieve higher speeds while simplifying design tradeoffs. The 3M embedded capacitor material is used in a multilayer PCB to connect other layers in a multilayer PCB, thus the 3M embedded capacitor material effectively becomes a decoupling capacitor inside the board. The material allows designers to eliminate large numbers of decoupling capacitors, increases useable board area, enables faster signaling, lowers radiated emissions (EMI), and saves engineering time associated with power distribution design and board layout. Printed circuit board fabricators can use the material in military, automated test equipment, computer and telecommunications applications.

"Integrating 10G Serial onto a Large Digital CMOS ASSP: Taking 10G from Lab to Production" is the title of a joint paper by Cortina Systems and 3M and will be presented Feb. 4 from 8:30 a.m. to 9:15 a.m. The paper discusses the successful integration of 10G Serial I/O onto a large integrated CMOS ASSP chip. 3M provides the multilayer IC substrate/package. The 3M and Cortina Systems collaboration resulted in a high-performance package and design guidelines that allows the package to interface with a low-cost, standard FR-4 PCB and enables high speeds at a lower cost. George Hare, 3M product development specialist dealing with high-frequency/high-data-rate electrical modeling and simulation, contributed to the paper.

About 3M Electronic Solutions Division

3M Electronic Solutions, part of 3M Company, has numerous technologies and provides a wide range of products for the electronics market. It provides flexible and multilayer microinterconnect packaging solutions; copper and fiber connectors, cables, and assemblies; static control products; tape and reel transport media for passive, semiconductor and electro-mechanical components; and test and burn-in sockets. More information on 3M Microinterconnect Products is available on the Internet at http://www.3M.com/microinterconnect.

About 3M -- A Global, Diversified Technology Company

Every day, 3M people find new ways to make amazing things happen. Wherever they are, whatever they do, the company's customers know they can rely on 3M to help make their lives better. 3M's brands include icons such as Scotch, Post-it, Scotchgard, Thinsulate, Scotch-Brite, Filtrete, Command and Dyneon. Serving customers in more than 200 countries around the world, the company's 67,000 people use their expertise, technologies and global strength to lead in major markets including consumer and office; display and graphics; electronics and telecommunications; safety, security and protection services; health care; industrial and transportation. For more information, including the latest product and technology news, visit www.3M.com.

3M, Scotch, Post-it, Scotchgard, Thinsulate, Scotch-Brite, Filtrete, Command and Dyneon are trademarks of 3M.

Contact:

3M Electronic Solutions Division, Austin
Matthew Fagan, 512-984-3277

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